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  1. Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services - Quik-Pak

    Same day packaging and custom assembly services. Utilize your own proprietary packaging designs.
    rapid prototyping2
    mems1
    bga1
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    wire bonding1
    laser machining1
    radiation detector1
    ic packaging1
    wafer dicing1
    chip-on-board1
    ic assembly1
    ceramic packages1
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    die sort1
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    ic encapsulation1
    ic packages1
    stacked die1
    die thinning0
    ic prototypes0
    open cavity plastic package0
    wafer preparation0

    www.icproto.com - 2009-02-13

  2. Synova - Laser MicroJet - laser cutting system - water jet guided laser cutting, dicing, grooving, wafer edge grinding

    Inventor of the Laser MicroJet technology, Synova is the unique supplier of water jet-guided laser cutting systems for a broad range of micro-machining ...
    laser cutting2
    manufacturing equipment1
    grooving1
    micromachining1
    micro machining1
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    dicing1
    scribing1
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    wafer dicing1
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    laser micromachining1
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    laser cutting system1
    lmj1
    stencil cutting1
    edge grinding1
    laser dicing1
    synova1
    laser grinding1
    laser grooving1
    lasermicrojet1
    laser microjet1
    water jet guided laser1
    water jet laser1
    waterjet laser1

    www.synova-asia.com - 2009-02-06

laser cutting2 tube benders1 laser drilling1 saw dicing1 display case1 laser engraving1 micro2 laser3 sapphire2 laser dicing1 dicing1 laser welding1 mems1 laser marking1 nano2 ceramic3 cutting2 paint booth1 nanotechnology2

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